Pani hoʻolaha

Ma kēia ʻatikala hōʻuluʻulu, hoʻomanaʻo mākou i nā hanana koʻikoʻi i hana ʻia ma ka honua IT i nā lā 7 i hala.

ʻO ka mea hoʻohui USB 4 pono e lilo i mea hoʻohui "universal".

mea hoʻohui USB i nā makahiki i hala iho nei, ʻoi aku ka nui o nā hana i hana ʻia pehea e hoonui lakou kāna hiki. Mai ka manaʻo mua e hoʻopili i nā peripheral, ma o ka hoʻouna ʻana i nā faila, ka hoʻouka ʻana i nā mea pili, a hiki i ka hiki ke hoʻouna i kahi hōʻailona leo-kiʻi i ka maikaʻi loa. Eia naʻe, mahalo i nā koho ākea loa, aia kahi ʻano o ka ʻāpana o ka maʻamau holoʻokoʻa, a pono e hoʻoholo ʻia kēia. 4th hanauna kēia mea hoʻohui. Pono ka USB 4th generation e hōʻea i ka mākeke i keia makahiki a ʻo ka ʻike mua mua e hōʻike ana e pili ana ia loa hiki mea hoʻohui.

Pono ka hanauna hou e hāʻawi pālua hoʻoili ka māmā holo hoʻohālikelike ʻia me USB 3 (a hiki i 40 Gbps, e like me TB3), ma 2021 a laila hoʻohuihui maʻamau Hōʻike kiʻi 2.0 i ka USB 4. E lilo kēia i USB 4th hanauna i mea hoʻohui i ʻoi aku ka maʻalahi a me ka hiki ke hoʻopili ma mua o ka hanauna o kēia manawa a me ka ʻike mua o ka wā e hiki mai ana. Ma kāna hoʻonohonoho kiʻekiʻe, kākoʻo ʻo USB 4 i ka hoʻoili wikiō o ka hoʻonā 8K / 60Hz a me 16K, mahalo i ka hoʻokō ʻana i ka maʻamau DP 2.0. Hoʻopili ka mea hoʻohui USB hou i nā hana āpau o ka mea i loaʻa maʻamau i kēia mau lā Hekili 3, a hiki i kēia manawa i laikini ʻia iā Intel, a ua hoʻohana i ka mea hoʻohui USB-C, i laha loa i kēia lā. Eia nō naʻe, ʻo ka hoʻonui nui ʻana o ka mea hoʻohui hou e lawe mai i nā pilikia me kāna mau ʻano like ʻole, e ʻike maoli ʻia. "holoʻokoʻa"ʻAʻole maʻamau ka mea hoʻohui USB 4 a ʻike ʻia kekahi o kāna mau hana i nā ʻano mea like ʻole ilihune, hoololi. E huikau a paʻakikī kēia no ka mea kūʻai hope - aia ke kūlana like loa i ke kahua USB-C/TB3. Lana ka manaʻo e ʻoi aku ka maikaʻi o nā mea hana ma mua o ka wā i hala.

Ke hana nei ʻo AMD me Samsung ma nā SoC mobile ikaika loa

I kēia manawa, ʻo nā kaʻina hana mai Samsung kahi mea ʻakaʻaka no nā mea he nui, akā hiki koke i ka hopena. Ua hoʻolaha ka hui ma kahi o hoʻokahi makahiki i hala hoʻolālā ka launa pū ʻana s AMD, kahi e puka mai ai hou kiʻi kiʻi kuhina nui no nā polokalamu kelepona. E hoʻokō ʻia kēia e Samsung i kāna Exynos SoCs. I kēia manawa ua ʻike ʻia nā mea mua ma ka pūnaewele pakele nā hōʻailona, ​​​​ e hōʻike ana i kona ʻano. Ke manaʻo nei ʻo Samsung, me AMD, e kāpae iā Apple mai ka noho aliʻi hana. ʻAʻole hōʻike ʻia nā ʻōkuhi leaked inā e kūleʻa lākou, akā hiki iā lākou ke hōʻike i ke ʻano o kā lākou hana ma ka hoʻomaʻamaʻa.

  • ʻO GFXBench Manhattan 3.1: 181.8 palapala mōlina no kekona
  • GFXBench Aztec (Maʻamau): 138.25 palapala mōlina no kekona
  • GFXBench Aztec (Kiʻekiʻe): 58 palapala mōlina no kekona

No ka hoʻohui ʻana i ka pōʻaiapili, aia ma lalo nā hopena i loaʻa i kēia mau hiʻohiʻona e ka Samsung Galaxy S20 Ultra 5G me ka kaʻina. Snapdragon 865 a me nā GPU Adreno 650:

  • ʻO GFXBench Manhattan 3.1: 63.2 palapala mōlina no kekona
  • GFXBench Aztec (Maʻamau): 51.8 palapala mōlina no kekona
  • GFXBench Aztec (Kiʻekiʻe): 19.9 palapala mōlina no kekona

No laila, inā pili ka ʻike ma luna o ka ʻoiaʻiʻo, hiki i Samsung ke hana nui ma kona mau lima Māhele, me ka (ʻaʻole wale) holoi ʻo Apple i kona mau maka. ʻO nā SoC mua i hana ʻia ma ke kumu o kēia hui pū ʻana e hiki i nā kelepona maʻamau i loaʻa i ka makahiki e hiki mai ana.

ʻO Samsung Exynos SoC a me AMD GPU
Puna: Samsung

Ua lele nā ​​kikoʻī o ka mea hoʻokūkū pololei ʻo SoC Apple A14 ma ka Pūnaewele

ʻO ka ʻike e wehewehe i nā kikoʻī o ka SoC kiʻekiʻe e hiki mai ana no nā polokalamu kelepona - Qualcomm - ua hiki i ka pūnaewele Snapdragon 875. ʻO ia ka Snapdragon mua loa e hana ʻia 5nm kaʻina hana hana a me ka makahiki aʻe (i ka wā e hoʻokomo ʻia ai) ʻo ia ka mea hoʻokūkū nui no SoC Apple A14. Wahi a ka ʻike i paʻi ʻia, pono e loaʻa i ka mea hana hou CPU Kryo 685, ma muli o nā kernels lima Cortex v8, hui pū me ka mea hoʻokele kiʻi Adreno 660, Adreno 665 VPU (Video Processing Unit) a me Adreno 1095 DPU (Display Processing Unit). Ma waho aʻe o kēia mau mea hoʻopili, e loaʻa pū ka Snapdragon hou i nā hoʻomaikaʻi i ke kahua o ka palekana a me kahi co-processor hou no ka hoʻoili ʻana i nā kiʻi a me nā wikiō. E hōʻea mai ka chip hou me ke kākoʻo no kahi hanauna hou o nā hoʻomanaʻo hana LPDDR5 a ʻoiaʻiʻo e loaʻa pū kekahi kākoʻo no (a laila ʻoi aku paha ka loaʻa) 5G pūnaewele ma nā pūʻulu nui ʻelua. Ma mua, ua manaʻo ʻia kēia SoC e ʻike i ka mālamalama o ka lā ma ka hopena o kēia makahiki, akā ma muli o nā hanana i kēia manawa, ua hoʻopanee ʻia ka hoʻomaka ʻana o ke kūʻai aku e kekahi mau mahina.

ʻO SoC Qualcomm Snapdragon 865
Puna: Qualcomm

Ua hoʻolauna ʻo Microsoft i nā huahana Surface hou no kēia makahiki

I kēia lā, ua hoʻolauna ʻo Microsoft i nā mea hou i kekahi o kāna mau huahana i ka laina huahana ili. ʻO ka mea kūikawā, he mea hou ili Book 3, ili Go 2 a me nā mea i koho ʻia. Papapalapala ili Go 2 Ua loaʻa iā ia kahi hoʻolālā hou, loaʻa iā ia kahi hōʻike hou me nā kiʻi liʻiliʻi a me kahi hoʻonā paʻa (220 ppi), nā kaʻina hana 5W hou mai Intel e pili ana i ka hoʻolālā. Amber Lake, ʻike pū mākou i nā microphones pālua, 8 MPx nui a me 5 MPx mua kāmela a me ka hoʻonohonoho hoʻomanaʻo like (64 GB base me ka hiki ke hoʻonui ʻia 128 GB). ʻO kahi hoʻonohonoho me ke kākoʻo LTE he mea pono. ili Book 3 ʻaʻole i ʻike i nā loli nui, ua hana nui lākou i loko o ka mīkini. Loaʻa nā mea hana hou Intel Helu 10 hanauna, a hiki i ka 32 GB o RAM a me nā kāleka kiʻi hoʻolaʻa hou mai nVidia (a hiki i ka hiki ke hoʻonohonoho me ka nVidia Quadro GPU ʻoihana). Ua loaʻa nō hoʻi nā hoʻololi ʻana i ka interface charging, akā nalo ka mea hoʻohui Thunderbolt 3.

Ma kahi o ka papa a me ka pona, ua hoʻolauna pū ʻo Microsoft i nā headphone hou ili Headphones 2, e hahai ana i ka hanauna mua mai 2018. Pono kēia kükohu e ho'omaika'i i ka maika'i o ke kani a me ke ola pākaukau, kahi ho'olālā earcup hou a me nā koho kala hou. Loaʻa ka poʻe makemake i nā headphone liʻiliʻi ili Earbuds, ʻo ia ka manaʻo o Microsoft i nā pepeiao pepeiao ʻole piha. ʻO ka mea hope loa, ua hōʻano hou ʻo Microsoft i kāna ili Kauka 2, ka mea i hoʻonui i kona pilina. E kūʻai ʻia nā huahana a pau ma Mei.

Ua hoʻolauna ʻo AMD i nā kaʻina hana (ʻoihana) no nā puke puke

Me AMD ke kamaʻilio ʻia nei ma kahi ala nui i kēia lā, ua hoʻoholo ka hui e hoʻohana pono iā ia a hoʻolaha i kahi hou "ʻoihana"lālani lawe lima nā mea hana. ʻO kēia nā chips i ʻoi aʻe a i ʻole e pili ana i ka 4th generation mainstream consumer mobile chips i hoʻolauna ʻia e ka hui 2 mau pule i hala. ʻO kā lākou no akā naʻe, ʻokoʻa nā ʻano like ʻole i nā ʻano he nui, ʻoi aku ka nui o nā cores ikaika, ka nui o ka cache a hāʻawi pū i kekahi "ʻoihana” nā hana a me nā hoʻonohonoho aʻo i loaʻa i nā CPU "mea kūʻai" maʻamau ʻaʻole lākou. Hoʻopili kēia i kahi kaʻina hana ʻoi aku ka maikaʻi palapala hōʻoia a me ke kākoʻo lako. Kuhi ʻia kēia mau chips no ka hoʻolaha nui ʻana i loko hana, hana a me nā ʻāpana like ʻē aʻe kahi i kūʻai nui ʻia ai a koi ʻia nā polokalamu i kahi pae kākoʻo ʻē aʻe ma mua o nā PC/laptops kahiko. Hoʻokomo pū nā mea hana i ka palekana a i ʻole nā ​​​​hana diagnostic e like me AMD Memory Guard.

No nā mea hana ponoʻī, hāʻawi ʻo AMD i ʻekolu mau hiʻohiʻona - ʻO Ryzen 3 Pro 4450U me 4/8 cores, 2,5/3,7 GHz frequency, 4 MB L3 cache a me iGPU Vega 5. ʻO ka ʻokoʻa waena ʻO Ryzen 5 Pro 4650U me 6/12 cores, 2,1/4,0 GHz frequency, 8 MB L3 cache a me iGPU Vega 6. ʻO ke kumu hoʻohālike kiʻekiʻe a laila ʻO Ryzen 7 Pro 4750U me 8/16 cores, 1,7/4,1 GHz alapine (frequency), like 8 MB L3 cache a me iGPU Vega 7. Ma na hihia a pau, he waiwai 15 W chips.

Wahi a AMD, aia kēia mau nūhou i ka o 30% ʻoi aku ka ikaika ma ka monofilament a hiki i ka o 132% ʻoi aku ka ikaika i nā hana he nui. Ua hoʻonui ʻia ka hana kiʻi ma kahi hapa ma waena o nā hanauna 13%. Hāʻawi ʻia i ka hana o nā pahu kelepona hou a AMD, maikaʻi loa inā ʻike ʻia lākou ma MacBooks. Akā, ʻoi aku ka pololei manao manao, ina aole he mea maoli. He mea hilahila nui kēia, no ka mea, ke pāʻani nei ʻo Intel i ka fiddle lua.

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